Ukhuphiswano lwe-EUV rage kwezi zixhobo zepemiconductor yecala

Inzuzo yeTokyo Electronics yi "Coater Developer". Esi sixhobo sisetyenziselwa ukudibanisa ulwelo olunekhemikhali olukhethekileyo kwi-silicon wafer njengesixhobo semiconductor sokuphuhlisa. Kwintsimi yezixhobo zokuvelisa ngobuninzi be-EUV, isabelo sentengiso senkampani sisikhulu se-100. Ukuthengisa okuhlanganisiweyo kulo nyaka-mali kulindeleke ukuba kufikelele kwi-1.28 yeetriliyoni yen. Ngaphezu kwe-10% yoku kuyakusetyenziselwa ukwenza uphando kunye nophuhliso ukudibanisa umphambili kwinqanaba le-EUV.

Kwimakethi yezixhobo zokwenza semiconductor kwintengiso engaphezulu kwe-6 yeetriliyoni ngonyaka, kutshintsha utshintsho.

Ukucekeceka komgca wokujikeleza ububanzi be-semiconductor, okuphezulu kokusebenza, kunye nemveliso yangoku yokusika yomda zii-nanometers ezi-5. Ukutshintshela isekethe ethambekileyo kwisikhewu esine-silicon, umatshini we-EUV lithography ubalulekile. Ngokukhula kokunikezelwa kwe-ASML, ekuphela kwendlela eveliswe ngobuninzi ye-EUV kwihlabathi, ukhuphiswano lophuhliso kubandakanya izixhobo zecandelo lobuchwephetsha kunye namabala okukhanya sele eqalile.

Isimboli zotshintsho oluvelisayo ngumvelisi wezixhobo zovavanyo uLasertec. Ukuba kukho iziphene kwi-Photomask njengebhodi yesekethe yoqobo, izinga lesiphene semiconductor liya kunyuka ngokufanelekileyo. Inkampani ivelisa izixhobo zovavanyo ezixhasa i-EUV, kwaye ii-odolo zayo ukusuka kuJulayi ka-2019 ukuya ku-Matshi 2020 zonyuke amatyeli angama-2.2 ukusuka kwithuba elifanayo kunyaka ophelileyo, ifikelela kwi-65,8 yezigidigidi yen. Isibini kwisithathu somyalelo wonyaka kulindeleke ukuba sihlobane ne-EUV.

Ukongeza, iingxabano ezibi phakathi kweenkampani zaseJapan nazo ziyaqhubeka. Kwicandelo loomatshini bokubhala imashini yokubhala i-elektroni, iToshiba's NuFlare Technology ibamba umanyano phakathi kweJEOL ne-IMS NANOFABRICATION (e-Austria). Eyona nto kugxilwe kuyo kuphuhliso lwetekhnoloji ye "Multi-Beam" isebenzisa i-260,000 beams.

NgoJanuwari, uToshiba wagxotha i-HOYA, eyayiqala i-TOB enoburhabaxa (isinikezeli sethenda sikawonke-wonke), kwaye yadibanisa ulawulo lwayo e-Niu Fulai. Iingcali zophuhliso ezingama-25 ezisandula ukuthunyelwa, njl njl. Isicwangciso sokubonelela ngezixhobo ze-EUV ezixhasa isizukulwane esilandelayo nge-2020.

IGigaphoton (ebekwe kwisiXeko saseOyama, Tochigi Prefecture), inxaso-mali yeKomatsu evelisa imithombo ye-laser, ijonge phambili ekubuyeni. Ngaphambi kokuqala kwe-EUV, inkampani yaba yenye yezona zimbini ziphezulu kwicandelo lemithombo yokukhanya. Nangona kunjalo, ngenxa yezizathu ezinje ngokufunyanwa komntu okhuphisana ne-ASML, okwangoku ilahlekile ubukho bayo. UGigaphoton uzabalazela ukuphuhlisa izixhobo zokukhanya ezikhupha phezulu ngaphambi kokuba i-ASML iqalise ukusebenzisa isixhobo se-EUV esilandelayo ukuze iphinde yabelane ngokuthengisa.

Imvelaphi yeenkampani ukukhawulezisa uphuhliso lwezixhobo ze-EUV lukhuphiswano lwe-miniaturization oluqaliswe yi-Nokia yaseMelika kunye ne-TSMC. Imfuno ye-semiconductors ephezulu yokusebenza efana ne-5G yomelele, kwaye iinkampani zombini zikhuphisana kumatshini ngamnye we-ASML oxabisa ngaphezulu kweebhiliyoni ezingama-20. Kule nkqubo, amathuba oshishino eenkampani ezijikelezayo zokwenza izixhobo ziyakhula.

Iinkcukacha-manani ezivela kwi-International Semiconductor Equipment and Equipment Association (SEMI) kunye ne-Semiconductor Production Equipment Association of Japan (SEAJ) zibonisa ukuba isabelo sentengiso yezixhobo ze-semiconductor ezenziwe eJapan sasiyi-31.3% ngonyaka ka-2019, esidale malunga ne-30% ngaphambili Iminyaka engama-20.

Kwintsimi yezixhobo ze-lithography, uNikon noCanon babekhukulise imarike yehlabathi, kodwa basilela kukhuphiswano ne-ASML kwaye bawela emva kuphuhliso lwe-EUV. Kwintsimi ye-semiconductor, njengoko inkqubo yokuvelisa iya iba nzima, utyekelo lokuphumelela-kuthatha konke luyanda. Utshintsho oluvelisayo oluthatha i-EUV njengethuba liya kukhawulezisa ukusinda kwelona lifanelekileyo kwiinkampani zezixhobo.

"Utyalomali kwizixhobo ezishenxisayo kwimarike yamazwe aphelile," intloko yamalungu anxulumene ne-EUV kunye neenkampani zamacandelo bancwina. Njengoko urhulumente waseDatshi engakhange ayivume, i-ASML ayikwazanga ukuthumela ngaphandle imishini ye-EUV ye-lithography kwilizwe. Ukongeza, ukuthengwa kwezixhobo ezisecaleni kunye nenxalenye nako kunqunyanyisiwe.

Kukho ukungqubana kwezorhwebo phakathi kweChina ne-US ngasemva kwayo. Ukuba izixhobo ze-ASML azinakungeniswa elizweni, abavelisi be-semiconductor enkulu baya kushiya ukhuphiswano oluncinci. Urhulumente welizwe ubeka phambili injongo yokuba inqanaba lokuzimela ngokwazo semiconductor lifike kuma-40% nge-2020 nama-70% ngo-2025, kodwa oku kunzima ukufezekisa. Iimbono ezininzi zikholelwa ukuba i-United States yacinezela urhulumente wase-Datshi ukuba ayisebenzise njengesixhobo sesohlwayo.

Amanani avela kwi-International Semiconductor Equipment and Equipment Association abonisa ukuba imakethi yezixhobo zokwenziwa kweesemiconductor ngonyaka ka-2019 ibiziibhiliyoni ezingama-59.7 zeedola zaseMelika, ukonyuka nge-59% ngaphezulu kowama-2014. Ngeli xesha, imakethi yelizwekazi yandise ubukho bayo, kunye nesabelo sayo sehlabathi Imakethi iyonke inyuke ukusuka kwi-11.6% ngo-2014 yaya kuma-22,5%. Kwiinkampani ezivelisa izixhobo zaseJapan semiconductor, ilizwe elikhulu kuye kwaba yimarike ekunzima ukuyityeshela.

Ukuphuhliswa kwetekhnoloji ye-EUV kunzima, kwaye iindleko zeR & D zazo zonke iinkampani ziyanda. Ukuba imakethi ayisasebenzi, ukubuyela kutyalo mali kwamashishini kuya kulibaziseka, kwaye ukuphuculwa kweetekhnoloji ezintsha kunokuba nzima ukuqhubela phambili.