Nge-15 kaJuni, i-imeyile ye-Samsung yazisa ukuba iqalile ukuveliswa kobuninzi bemveliso ye-chip emininzi (i-UMCP) edibanisa iidram kunye nenkumbulo ye-nund.
Le mveliso idibanisa inkumbulo ye-Sord-Man-Style (i-LPDDR5) kunye ne-UFS3.1 isinxibelelanisi se-Inf Inkumbulo ye-Smartphones ibe enye, ukubonelela ngezisombululo zoqwalaselo oluphezulu kubavelisi be-Smartphone.
Ngokuka-Samsung Elektroniki, xa kuthelekiswa ne-IDFDR4X esekwe kwi-LPDDR4X ye-ITFS5 ye-LPDDR5 yemveliso entsha inyuke phantse i-50%, ukusuka kwi-25GB / s kwimemori ye-nund flash iphindwe kabini Ukusuka kwi-1.5 GB / s yonyuswa ukuya kwi-3GB / s.
I-i-I-I-ICP entsha ikwanceda ukwandisa impumelelo yendawo yee-smartphones ngokudibanisa idram kunye ne-nund sharmat yendawo yokulinganisa i-15,5 mm xm 14 mm, ngaloo ndlela ibonelela ngenye imisebenzi.
Ukongeza, uSamsung I-MCC unokwenziwa ngokulula ukuhlangabezana neemfuno ezahlukeneyo zee-smartphones kwimakethi ephakathi kwimakethi ephezulu. I-Dram Iaticcesty ukusuka kwi-6GB ukuya kwi-12GB, kunye neenketho zokugcina ukusuka kwi-128GB ukuya kwi-512GB.
I-Samsung igqibe ngempumelelo uVavanyo oluhambelana ne-LPDR5 I-ITCP kunye nabavelisi be-Smartphone, kwaye kulindeleke ukuba izibonelelo ze-ICCP zixhotyisiwe ziya kuqalisa ukufaka imarike ye nyanga.