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Ikhaya > Iindaba > UQhagamshelo lwe-TE lufumana i-MEMS sensor pressure sensor Umyili weSilicon Microstructures

UQhagamshelo lwe-TE lufumana i-MEMS sensor pressure sensor Umyili weSilicon Microstructures

NgokukaJames Consulting, unxibelelwano lwe-TE luya kufumana i-Silicon Microstructures, umenzi we-MEMS woxinzelelo lwe sensor esekwe eCalifornia, evela kwinkampani yaseJamani ye-semiconductor Elmos Semiconductor.

I-Elmos yafumana ii-Silicon Microstructures ngo-2001. I-Silicon Microstructures inembali yeminyaka engama-25 kwaye inezinto zayo ze-MEMS eCarlifonia, apho iphuhlisa kwaye isebenzisa uxinzelelo lwe-MEMS kunye nokuhamba kweenzwa zezixhobo zemizi-mveliso nezimoto, kubandakanya ivolumu ephezulu, uxinzelelo oluphezulu oluphezulu, uxinzelelo oluphezulu Iindawo nendawo. Iimveliso ezinxulumene nezicelo ezithintelweyo.

I-Silicon Microstructures ikwandiswa kweshishini layo lezempilo kunye neemveliso ezinjengeIntraSense. Usapho lwe-IntraSense losapho lwe-piezoresistive MEMS sensors pressure isetyenziselwa umlinganiselo wexinzelelo lwe-vivo lwezixhobo zonyango ezingonakalisiyo.

I-Silicon Microstructures 'IntraSense yomgca wemveliso yezixhobo zonyango ezingeneleli ezifana ne-catheters kunye ne-endoscopes

U-Anton Mindl, i-CEO ye-Elmos Semiconductor, uthe kwisiteyitimenti: "Intsapho ye-IntraSense yeemveliso ngoku ifikelele kwinqanaba elithile, kwaye ingathengiswa ngokukhawuleza ngeqabane elixhaswe ngemali ngeniso yemarike ebanzi (njenge-TE). Ingeniso. "

Ngokuka-Elmos, ukuthengiswa kweSilicon Microstructures kuya kuphawula ukuyekiswa kweshishini le-Elmos 'MEMS. I-Elmos iya kugxila kumashishini wayo ophambili we-semiconductor, ngokuyintloko kunxibelelwano lwezithuthi, ukhuseleko, i-Powertrain kunye nezicelo zenethiwekhi.

UQhagamshelo lwe-TE luya kugqibezela ukuthengiselana ngokusebenzisa iiNkxaso zeMilinganiselo yokuLunga (iPennsylvania, e-USA), kunye ne-Silicon Microstruction ziya kuba yinxalenye yeemfuno zoMlinganiso weNzwa. Ubungakanani bokulinganisa buye bufunyenwe ngoQhagamshelo lwe-TE ngo-2014. Isivumelwano kulindeleke ukuba sidale ukuvumelana phakathi kwe-Silicon Microstructures 'MEMS uyilo kunye namandla okwenza imveliso kudityaniswa nomgangatho wokusebenza we-TE Connecaction, isiseko sabathengi kunye nezixhobo ezikhoyo zokunxibelelana.

Intengiselwano kulindeleke ukuba igqitywe ukuphela kuka-2019, kwaye amaqela akazange achaze inani elithile lentengiselwano.